High-reliability ceramic packages and substrates help to miniaturize components used in smartphones, fiber optics, automotive electronics (such as headlight LEDs), and a wide range of other applications. Kyocera utilizes its broad expertise in materials, processing, and design technologies to ensure unparalleled substrate and package performance.
Less deformation through lower thermal distribution. Stronger chemical resistance. A range of surface profiles are available
Polishing plate features minimal deformation due to high thermal conductivity, low thermal expansion coefficient, high stiffness and excellent thermal uniformity. It also features excellent chemical resistance and various surface profile options including concave, flat or convex.